As ChatGPT ignites a worldwide AI boom and frontier technologies such as autonomous driving and the metaverse continue to devour computing power, data centers are facing an unprecedented thermal load crisis. A single high-performance chip now consumes up to 700W, generating enough heat in one hour to boil four liters of water. In a hyperscale AI data center with tens of thousands of servers, hourly heat emissions can rival those of a small thermal power plant.
Traditional air-cooling methods—akin to using a hand fan to cool a blast furnace—are no longer sufficient. Liquid cooling has shifted from a “nice-to-have” to a mission-critical necessity, enhancing system stability by about 40% and reducing energy consumption by approximately 20%, becoming essential infrastructure for the AI industry’s rapid expansion.

Why, then, has Far East Smart Energy Co., Ltd. (Far East, Stock Code: 600869) risen swiftly in the liquid-cooling arena and earned recognition from leading global AI chip manufacturers? The answer lies in its technological depth, innovation-driven strategy, and early-stage industrial insight.

Thermal Load Challenge: Liquid Cooling Becomes a Survival Imperative

The exponential growth of AI computing power has made thermal management one of the biggest barriers to industry advancement. According to IDC, China’s intelligent computing capacity will grow at a compound annual rate of 46.2% from 2023 to 2028, while general-purpose computing will grow by 18.8%.
Meanwhile, chip power consumption continues to break through previous limits—from 700W to 2700W, with next-generation chips expected to reach 3600W by 2027, pushing AIDC computing density even higher.

In this ultimate contest between computing and heat, liquid cooling has become the decisive solution. Comparable to equipping computing engines with a “superconductive cooling system,” liquid cooling keeps chips operating within a safe temperature range and significantly improves data center energy efficiency and operating cost.
As liquid cooling accelerates in adoption, a trillion-RMB industry chain—spanning coolant formulation, cold-plate manufacturing, and intelligent thermal control—is rapidly emerging, offering Chinese enterprises a rare opportunity to claim global leadership.

Forward-Looking Strategy: Heat-Dissipation Expertise Rooted in Industrial Heritage

Far East’s capabilities in liquid cooling are built on years of expertise rooted in its industrial heat-management background.
As a leading cable manufacturer, Far East has long faced challenges related to thermal performance under high power density—where heat dissipation determines product safety and lifespan. Over the years, the company developed a complete set of solutions, including overhead installation, natural ventilation in cable trenches, and combined air-water cooling. These experiences gave Far East a profound understanding of thermal materials, flow-channel design, and precision temperature control.

A milestone achievement came in 2021, when Far East’s liquid-cooled high-power charging-pile cable earned the first TÜV Rheinland certification in China and was successfully deployed at the Beijing Winter Olympics supercharging station. It maintained exceptional thermal stability at power levels above 1500kW, offering valuable insights for subsequent liquid-cold-plate development.

Far East also possesses early technical reserves in CPU liquid-cooling systems, providing a mature foundation for advanced cold-plate design.
Meanwhile, in materials science, Far East independently developed a third-generation graphene-copper composite, combining quantum-level conduction with the inherent advantages of copper, significantly enhancing thermal performance. This material has passed authoritative certification from the National Center for Nonferrous Metals and Electronic Materials Testing.

Technological Breakthrough: Innovative Solutions to Industry Pain Points

The core competitiveness of liquid-cooling lies in technological breakthroughs. Far East has introduced an innovative, integrated solution featuring bionic manifold micro-channel cold plates paired with advanced thermal interface composite materials.

In collaboration with Xi’an Jiaotong University and Shanghai Jiao Tong University, Far East leveraged industry–academic–research synergy to accelerate development. Inspired by vascular and leaf-vein structures in nature, the design incorporates multi-stage converging uniform-flow channels and local redevelopment structures. This enables fast, uniform coolant distribution beneath chips, dramatically enhancing heat-transfer efficiency while reducing pressure drop.
At the same time, the high-conductivity composite materials form an embedded thermal path within the micro-channel structure, lowering thermal resistance and reducing surface temperature variation, precisely extracting heat from high-flux regions.

A series of rigorous tests have validated the solution’s strong performance: compared with industry-standard single-phase cold plates with a 1000W dissipation limit, the Far East design achieves a significant leap in heat-dissipation efficiency at lower pumping power.

With superior cooling capacity, low energy consumption, and excellent temperature uniformity, the technology can be widely applied in next-generation GPU/CPU liquid-cooled accelerator cards, data-center servers, high-power power-electronics modules, and RF chips. It is also compatible with advanced packaging technologies and suitable for large-scale industrial deployment.

Ecosystem Collaboration: The Core Strength Behind Global Recognition

As liquid cooling becomes mainstream, a new ecosystem is taking shape—from coolant chemistry and precision machining to smart thermal-management systems—forming a trillion-RMB market opportunity.

Far East’s strategic roadmap aligns closely with these industry trends. By integrating “electric power + computing power + AI,” the company is advancing deep convergence between energy and intelligent-computing scenarios. It has earned the highly coveted Vendor Code from a world-leading AI chip manufacturer, as well as vendor status from China’s major AI-computing chip leaders.

Building on long-term cooperation in cables and thermal materials, Far East supplies high-speed copper cables, autonomous-driving data-transmission wires, automotive cables, power cables, connectors, and more to top global AI chip customers. The company is rapidly advancing R&D and testing of next-generation chip cold plates, HVLP, BBU, and other critical technologies.
Meanwhile, its related products are undergoing collaborative testing with leading domestic chip makers and mainstream cloud-service operators.

Against the backdrop of surging global AI computing demand, Far East is not only helping to solve some of the world’s toughest chip-thermal-management challenges but is also strengthening China’s position as an indispensable force in the high-end thermal-management industry chain.